1) Automatic Wafer Cassette
Opener
2) Wafer Thickness Measuring & Sorting Machine
3) Automatic Laser Marking Machine
Model: SAB300X
Features: Common
use for Miraiaru FOSB and Shin-Etsu FOSB
Specification: Cycle time: Within
10 sec. (Each process)
Utility requirement
Power: AC 100V, 50～60 Hz, 80 VA
Compressed air: 0.5 MP
Vacuum: -70 kPa
Overall size: 773 mm (W) x 725 mm (D) x 1,386 mm
Weight: 250 kg
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Application
This machine measures wafer thicknesses by non-contact method, and
sorts wafers from cassette to cassette according to measured data.
Specification
Wafer size: 8, 6 and 5 inch
No. of cassettes (No. of wafers)
Loading side 4 cassettes (100 wafers)
Unloading side 12 cassettes (300 wafers)
Sorting modes (Cycle time)
Sorting by preset range (5 min./cassette)
Sorting by order (10 min./cassette)
Measuring point One point (Center)
Resolution 0.1μm
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Application
This is a machine incorporating a YAG laser marker to automatically
mark on silicon wafer surface.
Features
This machine full-automatically marks on surface of silicon wafers
from basket to basket. It is possible to mark rust-free characters
on special coating or plating, even small characters clearly, and
mark high sped even on a curved surface.
Specification
Wafer size: 8 and 6 inch
Wafer thickness: 0.5 ～2.0 mm
Orientation flat
8 in. wafers 1-orientation flat and 1-notch
6 in. wafers 1-orientation flat
Lot size: 25 wafers/cassette max (Total height: 160 mm max.)
Cycle time: 40 sec./wafer
Marking position: 360°from orientation flat (every 1°)
Overall size: 2,000 mm (W) x 820 mm (D) x 1,225 mm (H)(Marking machine
only)
Weight 520 kg (Marking machine only)
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